The greatest power densities on the smallest space are often the basis for unique selling points of various products on the market. These criteria can be realized by the (Chip on Board ) COB LEDs technology.

Direct contacting of the semiconductors (LEDs) on PCBs allows for optimal thermal management, high packaging density and thus long-lasting and high-performance COB LED modules.

With this technology, the LED chips are in the form of a semiconductor chip, which is neither encased nor connected. The semiconductor chip is described as a "Die". This LED chip is processed by means of a special procedure which is called "Die Bonding". Here the individual chips are placed on the PCB and using the Wire Bonding method, connected to the contact surface of the PCB, which are described as "Pads". Gold wires in the micrometer range are used for contacting. COB LED light technology allows for virtually limitless freedom of scope for the PCBs and thus serves as the basis for totally unique LED solutions.